Damaged Thermal Pad? Alternatives with Copper Shim & Thermal Paste

Thermal pads are simple yet crucial components in laptops and other electronics. They bridge the gap between hot components (such as VRAM, MOSFETs, chipsets) and the heatsink, allowing proper heat transfer. Unfortunately, thermal pads often deteriorate: they crumble, harden, or lose elasticity. As a result, air (an insulator) fills the gap, reducing heat transfer and causing overheating.

So, what are the solutions if the original thermal pad is no longer usable?

Alternatives to Replace Thermal Pads

1. Copper Shim + Thermal Paste

A copper shim is a thin copper plate placed between the component and the heatsink, with thermal paste applied on both sides.

Steps:

1. 1. Measure the thickness of the original thermal pad (usually 0.5–2 mm).

2. 2. Select a copper shim close to that thickness.

3.    Example: For a 1 mm pad → use a 0.8 mm shim + thin paste layer on both sides.

4. 3. Ensure the shim sits flat and does not apply excessive pressure.

Advantages:

• Very high thermal conductivity (copper ≈ 400 W/mK).

• Durable, does not easily deteriorate.

Risks:

• Incorrect sizing can cause excessive pressure or even short circuits.

• Requires careful installation to prevent shim from shifting.

2. Thick Thermal Paste

If the gap is very small, thermal paste alone can be used without a pad.

• Best for gaps ≤0.3 mm.

• Apply evenly in a thin layer, avoid excess thickness.

Advantages:

• Simple, cheap, quick.

Drawbacks:

• Not stable for larger gaps.

• Shorter lifespan as paste can dry out.

3. Using a New Thermal Pad

For larger gaps (>1 mm) or areas subject to vibration (e.g., gaming laptop VRAM), a thermal pad remains the best option.

• Choose high-quality aftermarket pads (e.g., Fujipoly, Gelid, Arctic).

• Ensure thermal conductivity ≥6 W/mK for optimal results.

Quick Gap Guidelines

• Gap ≤0.3 mm → use thermal paste only.

• Gap 0.3 – 1 mm → use copper shim + thin paste.

• Gap >1 mm → use a new thermal pad.

⚠️ Technical Safety Tips

• Measure the gap carefully (use feeler gauge or manual check).

• Always apply thin paste layers on both sides of the copper shim.

• Ensure the shim cannot shift when mounting the heatsink.

• For sensitive areas (RAM, VRAM), flexible thermal pads are safer.

Conclusion

A damaged thermal pad does not mean the end of the cooling solution. There are three main alternatives: thermal paste, copper shim + paste, or a new thermal pad. The best choice depends on the gap size, mechanical pressure risk, and long-term reliability needs.

With the right approach, cooling performance can remain optimal and component lifespan extended.